BGA

Circuit board manufacturer: introduction to the basic principle of BGA repair bench

The circuit board manufacturer, circuit board designer and PCBA manufacturer explain the basic principles of BGA repair bench

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Use liquid gasification latent heat to check the tin and solder joints on the circuit board?

How to use the latent heat of vaporization of liquid to carry out tin on circuit board and solder joint inspection of circuit board

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How to strengthen BGA from the design end to prevent its solder joints from cracking?

The circuit board manufacturer and circuit board designer explain how to strengthen BGA from the design end to prevent its solder joints from cracking

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Several inspection methods for defects of BGA solder ball welding

The circuit board manufacturer and circuit board designer explain several inspection methods for BGA solder ball welding defects

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Teach you how to use X-Ray to check the solderability of BGA solder balls

The circuit board manufacturer and circuit board designer explain how to use X-Ray to check the solderability of BGA solder ball

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ENIG Surface Treatment of Circuit Board and Its Advantages and Disadvantages

Circuit board manufacturers and circuit board designers will explain the ENIG surface treatment of circuit boards and their advantages and disadvantages

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Function and Operation Procedure of Bottom Filler in PCB Production

The circuit board manufacturer and circuit board designer explain the function and operation procedure of bottom filler in PCB production

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SMT placement order selection of steel two-sided component PCB

The circuit board manufacturer and circuit board designer will explain the SMT placement sequence selection of steel double-sided components PCB

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Detailed explanation of BGA components and their repair process

The circuit board manufacturer and circuit board designer explain BGA components and their repair process

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Detailed explanation of BGA repair and ball planting process

The circuit board manufacturer and circuit board designer will explain BGA repair and ball planting process to you

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BGAチップの分解・はんだ付け方法を基板メーカーが解説

回路基板メーカーと回路基板設計者が説明する、BGAチップの分解とはんだ付けの方法

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Mobile phone PCB wiring layout has risks and should be cautious

The circuit board manufacturer and circuit board designer explain the PCB wiring of mobile phones

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